CHARGE TRAPPING AND INTERFACE STATE GENERATION IN RAPID THERMAL PROCESSED OXIDE AND NITRIDED-OXIDE MOS CAPACITORS BY ELECTRON PHOTOINJECTION FROM AL GATE AND SI SUBSTRATE
Xj. Yuan et al., CHARGE TRAPPING AND INTERFACE STATE GENERATION IN RAPID THERMAL PROCESSED OXIDE AND NITRIDED-OXIDE MOS CAPACITORS BY ELECTRON PHOTOINJECTION FROM AL GATE AND SI SUBSTRATE, Journal of the Electrochemical Society, 142(3), 1995, pp. 1021-1024
Charge trapping and interface state generation in rapid thermal proces
sed (RTP) oxide and NH3-nitrided oxide metal oxide semiconductor capac
itors have been investigated by internal photoemission (IPE) electron
injection from both the Al gate and the Si substrate. It is found that
the generation rate of the interface state (D-it) by IPE electron pho
toinjection from the Si substrate is one order of magnitude higher tha
n that from the Al gate for both RTP oxide and nitrided oxide samples
at low electron injection fluence, N-inj < 1 x 10(16) electron/cm(2).
The polarity dependence of interface state generation is discussed by
means of the hydrogen species induced D-it generation model. Photocurr
ent voltage (photo-IV) technique has been used to determine the centro
id and density of trapped charge after IPE electron photoinjection int
o the dielectrics from both electrodes.