ADVANCED SOLDER MATERIALS FOR ELECTRONIC ASSEMBLIES

With environmental considerations in mind, lead-free solder materials have been under development for some time now. These materials are cla ssified in terms of their compatibility with existing manufacturing te chniques for printed-board assemblies. Another criterion is the fatigu e properties of solder materials for use with complex printed-board as semblies operating at high temperatures. Lead-free solders must at lea st match the manufacturing yields commonly achieved today, without red ucing the reliability of the soldered joints.