Sj. Xia et Wf. Zhou, THE REDUCTION PROCESS OF THE ANODIC PB(II) OXIDE FILM ON LEAD PLUS BISMUTH ALLOY IN SULFURIC-ACID-SOLUTION, Electrochimica acta, 40(2), 1995, pp. 181-187
The anodic film studied was formed on Pb + 9 at. % Bi at 0.9 V (vs. Ag
/Hg2SO4) in 4.5 M H2SO4 solution (25 degrees C). The change of the pha
se composition of the anodic film during reduction at -0.91 V (vs. Hg/
Hg2SO4) (slightly more positive than that of the reduction potential o
f PbSO4) was determined by X-ray diffraction (XRD). The experimental r
esults show that the crystals of PbO.PbSO4 and t-PbO in the anodic fil
m can be reduced, but Bi2O3 crystals cannot. However, Bi2O3 crystals c
an be reduced when PbSO4 crystals are cathodically reduced. The existe
nce of bismuth in alloy increases the corrosion rate of lead. The curr
ent-time transient shows that the process of reduction is limited by t
hree-dimensional growth of circular cones with progressive nucleation
when the potential is stepped from 0.9 to -0.91 V for the anodic film
on Pb + 9 at. % Bi, but for a thicker film it is also controlled by io
n transport through the film. The PbSO4 film formed on Pb is denser th
an that on Pb + 9 at. % Bi. The reduction process of the anodic film o
n Pb cannot be described by a simple nucleation and growth mechanism.