RADIALLY STAGGERED BONDING TECHNOLOGY

Citation
Rd. Pendse et al., RADIALLY STAGGERED BONDING TECHNOLOGY, HEWLETT-PAC, 47(6), 1996, pp. 41-50
Citations number
2
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
HEWLETT-PACKARD JOURNAL
ISSN journal
00181153 → ACNP
Volume
47
Issue
6
Year of publication
1996
Pages
41 - 50
Database
ISI
SICI code
0018-1153(1996)47:6<41:RSBT>2.0.ZU;2-K
Abstract
This new approach to fine-pitch integrated circuit bonding entails a n ew configuration of bonding pads on the die, dual-loop wire bonding, a nd a new leadframe design that minimizes wire lengths. The approach by passes the usual obstacles to fine-pitch bonding that arise with the c onventional in-line approach, thus providing appreciable die size and cost reductions with a minimal assembly cost penalty.