Citation
Rn. Horner et al., IMPLEMENTATION OF PAD CIRCUITRY FOR RADIALLY STAGGERED BOND PAD ARRANGEMENTS, HEWLETT-PAC, 47(6), 1996, pp. 51-54
Citations number
2
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
HEWLETT-PACKARD JOURNAL
ISSN journal
00181153
→ ACNP
Volume
47
Issue
6
Year of publication
1996
Pages
51 - 54
Database
ISI
SICI code
0018-1153(1996)47:6<51:IOPCFR>2.0.ZU;2-G
Abstract
One approach to pushing the limits of wire bonding pitch in IC package
s is to use two rows of radially staggered band pads. This paper discu
sses the design of pad circuitry to mesh with the radially staggered b
ond pad arrangement. A test chip that incorporates suitable test struc
tures was designed, fabricated, packaged and tested to verify the viab
ility of the approach.