FIM AP ANALYSIS OF CU-PD MULTILAYERS

Multilayers were prepared on well developed tungsten field-ion microsc opy (FIM)-tips by subsequent deposition of Pd and Cu with a thickness of about 20 nm. These specimens were annealed isochronically at temper atures between 373 and 723 K. Ladder diagrams obtained by the atom-pro be (AP) from the as-prepared specimens showed an interface between Cu and Pd layers indicating a depth resolution of about 1 nm. The heat tr eated specimens revealed clearly an interdiffusion of the species betw een the layers. In addition, for the first time investigations with th e three-dimensional tomographic AP were performed on such compounds. P reliminary results on the as-prepared and annealed specimens are discu ssed and interdiffusion coefficients of CuPd are compared with data av ailable from literature.