The integration of oxidic buffer layers on silicon wafers with a latti
ce mismatch of up to 5% at the deposition temperature is investigated
via reflection high energy electron diffraction and transmission elect
ron microscopy (TEM). The strain relaxation during the deposition is o
bserved in situ by monitoring the lattice parameter the results can be
compared with TEM images recorded after the deposition, The decrease
in the strained yttria-stabilized zirconia lattice parameter on the si
licon substrate proceeds within 5-7 nm to its equilibrium value. The r
esults are used for better accomodation of multilayer packages and to
reduce the epitaxial stresses in the overlayer films. Results of high
temperature superconducting thin films on buffer layers with reduced e
pitaxial stresses are presented.