Erbium-doped InGaAs epilayers have been grown on InP(100) substrates b
y Liquid Phase Epitaxy (LPE) and their properties have been characteri
zed. In order to reduce the junction capacitance and thereby to improv
e the frequency response of the PIN photodiodes to several gigabits pe
r second, it is necessary to reduce the background carrier concentrati
on of the intrinsic layer to the low 10(15) cm(-3) range. Due to the r
esidual impurities of the source materials, it is extremely difficult
to achieve this level of background carrier concentration using the co
nventional LPE method. By adding 0.5 wt% of erbium in the growth melt
for intrinsic layer in the LPE growth, a background carrier concentrat
ion as low as 1X10(15) cm(-3) has been achieved.