Positron beam and helium desorption techniques have been applied to di
fferent materials, in particular semiconductor materials, to determine
the presence of defects. The positron technique yields values of the
positron diffusion length and values of the Doppler broadening paramet
ers. In principle, defect concentrations can be derived and an indicat
ion can be obtained about the nature of the defect. Results are presen
ted which show that cavities can be easily detected. It is also demons
trated that gas accumulated in the cavities reduces the observed diffe
rences between the defected and the defect-free material. Large caviti
es were detected in solar cell hydrogenated amorphous silicon and low
temperature deposited amorphous silicon. It was found that layers depo
sited under irradiation with low energy ions (ion assisted deposition)
did not show evidence of microcavities. Desorption techniques were su
ccessfully employed to detect cavities in silicon.