SELF-ALIGNED FLIP-CHIP PACKAGING OF TILTED SEMICONDUCTOR OPTICAL AMPLIFIER ARRAYS ON SI MOTHERBOARD

Authors
HUNZIKER W VOGT W MELCHIOR H LECLERC D BROSSON P POMMEREAU F NGO R DOUSSIERE P MALLECOT F FILLION T WAMSLER I LAUBE G
Citation
W. Hunziker et al., SELF-ALIGNED FLIP-CHIP PACKAGING OF TILTED SEMICONDUCTOR OPTICAL AMPLIFIER ARRAYS ON SI MOTHERBOARD, Electronics Letters, 31(6), 1995, pp. 488-490
Citations number
7
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronics Letters → ACNP
ISSN journal
00135194
Volume
31
Issue
6
Year of publication
1995
Pages
488 - 490
Database
ISI
SICI code
0013-5194(1995)31:6<488:SFPOTS>2.0.ZU;2-S
Abstract
An optical self-aligned flip-chip packaging technique for tilted semic onductor optical amplifier arrays is reported. It uses a Si motherboar d with V-grooves for self-alignment between the tilted SOA array and a ngle polished fibre arrays. Fibre-to-fibre gain of 14 +/- 1 dB and rip ple +/-0.1 dB without antirefelction coating on the fibres have been a chieved.