When bonded joints fail at less than design loads, it is often due to
either insufficient surface preparation or an inadequate adhesive cure
process. Generally, the failure process is recognized through adheren
d end peel and adhesive or cohesive failure. The typical interpretatio
n of the failure mechanism suggests that weak bonds can only be recogn
ized by early failure. However, recent experimental investigations hav
e indicated that faulty bonding does affects the adhesion stiffness an
d this can be detected by non-destructive testing without having to re
sort to destructive testing. This paper discusses these findings and p
ostulates a new approach to load transfer in adhesively bonded lap joi
nts which possess weakened bondlines.