CHARACTERIZATION AND TESTING OF POLYMER-OXIDE ADHESION TO IMPROVE THEPACKAGING RELIABILITY OF ISFETS

One of the problems preventing the widespread commercialization of ISF ETs is the lack of reliable packaging. The most important parameter in the packaging is the interface adhesion between the encapsulant and t he chip. This interface is characterized by two independent types of m easurements. Long-term C-V-measurements are used to check the water pe netration along the interface. CO2 and NH3 response measurements are u sed to show the existence of condensed water at the interface. It is s hown that the use of a suitable coupling agent improves the adhesion. However, vacuoles at the interface can still be formed and these can c ause a breakdown of the packaging. The use of thicker layers of encaps ulant will only postpone this breakdown.