MONOLAYER MOLECULAR ADSORPTION MODEL FOR ELECTROLESS COPPER PLATING PROCESS

Authors
SHIGEMATSU K KONDO K HAYAKAWA K IRIE M
Citation
K. Shigematsu et al., MONOLAYER MOLECULAR ADSORPTION MODEL FOR ELECTROLESS COPPER PLATING PROCESS, Journal of the Electrochemical Society, 142(4), 1995, pp. 1149-1152
Citations number
13
Categorie Soggetti
Electrochemistry
Journal title
Journal of the Electrochemical Society → ACNP
ISSN journal
00134651
Volume
142
Issue
4
Year of publication
1995
Pages
1149 - 1152
Database
ISI
SICI code
0013-4651(1995)142:4<1149:MMAMFE>2.0.ZU;2-R
Abstract
Monte Carlo simulation has been applied to the adsorption process on l iquid-solid interface. A simple monolayer molecular adsorption model w as proposed to analyze the electroless copper plating process and adso rption characteristics was discussed. The adsorption constant estimate based on the theoretically calculated desorption constants well repro duced the experimental values.