ELECTRON-BEAM LITHOGRAPHY OF 2-COMPONENT RADICAL-ION SALT FILMS - REVERSIBLE CHARGE-TRANSFER IN COPPER-TCNQ AND SILVER-TCNQ

The electron beam induced lithography process of radical ion salts of copper and silver tetracyanoquinodimethane (Cu(TCNQ)(x) and Ag(TCNQ)(1 ) with x=1 and 2), gives direct access to microstructures of these org anic conductors. The films are prepared in a vacuum chamber attached d irectly to a modified scanning electron microscope. They are obtained by a solid state reaction of subsequently deposited TCNQ and metal lay ers. Electrical measurements of wire structures have been performed in situ, showing a deviation from the expected resistance versus width r elation when approaching the micron scale. Absorption spectroscopy of large irradiated areas is used to identify the process being a back-tr ansformation of the salt into neutral TCNQ and suspended metal. The ap plication of these microstructures in the field of molecular electroni cs is discussed with respect to electrical and optical switching prope rties of these films.