IMPROVED CORROSION-RESISTANCE OF PULSE PLATED NICKEL THROUGH CRYSTALLIZATION CONTROL

When electrodeposition of nickel is used for corrosion protection of s teel two aspects are important: the porosity of the coating and the re sistance against corrosion provided by the coating itself, Using simpl e pulsed current (PC) plating, the size of the deposited crystals can be significantly smaller, thereby reducing porosity correspondingly. T his usually also leads to improved hardness of the coating, Introducin g pulse reversal (PR) plating, the most active crystals are continuous ly dissolved during the anodic pulse, providing a coating with improve d subsequent corrosion resistance in almost any corrosive environment, This correlation between film texture and corrosion resistance will b e discussed.