DEVELOPMENT OF AN ANISOTROPIC CONDUCTIVE ADHESIVE FILM (ACAF) FROM EPOXY-RESINS

A thermoset type anisotropic conductive adhesive film (ACAF), which el ectrically connects an ITO glass and a flex circuit both having conduc ting patterns of less than 100 mu m in pitch, has been developed. In t his development, bisphenol A and bisphenol F epoxy resins were tested to formulate an ACAF with easy-to-handle tackiness, flexibility, and s trength. A curing agent that gives fast cure and long shelf-life prope rties to the epoxy resin was also selected. The tensile stress-strain responses of obtained adhesive films were successfully used for determ ining the formulation. Good aftercure physical properties (electrical and mechanical) were obtained. Durability against high temperature and high humidity were also tested to confirm long-term stability of the conduction of this ACAF. (C) 1995 John Wiley and Sons, Inc.