A plating process for low-cost dielectric substrates (like polypropyle
ne or foam) has been developed by the CNET (Centre National d'Etudes d
es Telecommunications) in collaboration with LAM (Laboratoire Antennes
et Microelectronique). This process allows the realization of printed
radiating elements like microstrip antennas. An example of a multilay
ered printed antenna realized with this technology is presented with i
ts performance. (C) 1995 John Wiley & Sons, Inc.