a-Si1-xCx:H films were synthesized by r.f. plasma-assisted chemical va
pour deposition at deposition temperatures < 200 degrees C from methan
e-silane gas mixtures. By adjusting the r.f. power, the bias voltage V
-b was varied between -300 and -500 V. The film composition was measur
ed by electron probe microanalysis. The wear resistance (ball-on-disk
test) determined for films deposited at the two selected bias voltages
was correlated with their mechanical properties (depth-sensing indent
ation technique) and internal compressive stresses (bending beam metho
d). The performance of the a-Si1-xCx:H films was compared with that of
reference a-C:H films prepared under similar conditions. The mechanic
al properties (hardness and Young's modulus) and internal compressive
stresses for films deposited at -300 V are consistently higher than fo
r films deposited at -500 V. The better mechanical properties result i
n an improved wear resistance under humid nitrogen (50% relative humid
ity) conditions. In a humid air test environment, however, the improve
ment is negligible, most probably because of a tribochemical wear mech
anism due to the presence of oxygen. The same tendencies are observed
for the pure a-C:H films, which show on average a much higher wear res
istance.