DEPOSITION OF EPITAXIAL BETA-SIC FILMS ON POROUS SI(1OO) FROM MTS IN A HOT-WALL LPCVD REACTOR

Citation
Cc. Chiu et al., DEPOSITION OF EPITAXIAL BETA-SIC FILMS ON POROUS SI(1OO) FROM MTS IN A HOT-WALL LPCVD REACTOR, Journal of materials research, 10(5), 1995, pp. 1099-1107
Citations number
24
Categorie Soggetti
Material Science
ISSN journal
08842914
Volume
10
Issue
5
Year of publication
1995
Pages
1099 - 1107
Database
ISI
SICI code
0884-2914(1995)10:5<1099:DOEBFO>2.0.ZU;2-0
Abstract
Epitaxial beta-SiC thin films were grown on modified Si(100) substrate s from methyltrichlorosilane (CH3SiCl3 or MTS) in a hot wall reactor b y using low pressure chemical vapor deposition (LPCVD). At 1150 degree s C, the growth rate of the beta-SiC films was 120 Angstrom/min. Epita xial beta-SiC(100) thin films were deposited after the deposition time of 12.5 min. However, the crystallinity of the deposited films was in fluenced by the deposition time. For example, the occurrence of rotati onal beta-SiC(100) crystals and polycrystalline beta-SiC with a highly preferred orientation of (100) planes was obtained for the deposition time of 50 min. XRD and TEM showed the appearance of polycrystalline beta-SiC films with a preferred orientation of beta-SiC(111) after fur ther increasing the deposition times (time greater than or equal to 75 min). At 1100 degrees C, polycrystalline beta-SiC films with poor sur face morphology were observed even though the film had a preferred ori entation of beta-SiC(100) for short deposition time (e,g., 12.5 min). Polycrystalline beta-SiC(111) film was obtained for the deposition tim e of 200 min at this temperature.