3-DIMENSIONAL MORPHOLOGY OF A VERY ROUGH INTERFACE FORMED IN THE SOLDERING REACTION BETWEEN EUTECTIC SNPB AND CU

Authors
KIM HK LIOU HK TU KN
Citation
Hk. Kim et al., 3-DIMENSIONAL MORPHOLOGY OF A VERY ROUGH INTERFACE FORMED IN THE SOLDERING REACTION BETWEEN EUTECTIC SNPB AND CU, Applied physics letters, 66(18), 1995, pp. 2337-2339
Citations number
20
Categorie Soggetti
Physics, Applied
Journal title
Applied physics letters → ACNP
ISSN journal
00036951
Volume
66
Issue
18
Year of publication
1995
Pages
2337 - 2339
Database
ISI
SICI code
0003-6951(1995)66:18<2337:3MOAVR>2.0.ZU;2-K