DESIGN OF MULTILAYERED POLYMERIC DIELECTRIC INSULATORS FOR ADVANCED MICROELECTRONICS PACKAGING

2,2-Bis -((4-fluorophenyl)buta-1,3-diynyl)phenyloxyphenyl] hexafluorop ropane and co-polymer of 1,4-bis(4-fluoropheny)buta-1,3-diyne and hexa fluorobisphenol-A were prepared for the use as photosensitive multilay ered polymeric dielectric insulators. The prepared materials turned ou t to be stable at high temperatures as well as thermally or photochemi cally curable. It was found that the mechanical properties of cross-li nked products by thermal or photochemical curing of the prepared diace tylenic materials were much more improved in comparison with those of cured poly(triethynylbenzene)(PTEB).