FULL-WAVE CHARACTERIZATION OF A THROUGH HOLE VIA IN MULTILAYERED PACKAGING

A full-wave analysis is presented for the propagation characteristics of a through hole via connecting two semi-infinitely long transmission lines in multi-layered packaging environment, The current distributio n on the via and a section of transmission line is solved under the th in wire approximation by the moment method and the scattering paramete rs are extracted by the matrix pencil method, The Green's function in multilayer packaging environment is derived by applying the image theo ry and evaluated by the help of the Poisson summation formula, Numeric al results are included to investigate the frequency-dependent propaga tion characteristics for via structures with various geometrical param eters, e,g., the via height, wire diameter, and distance between two g round planes, The excitation of the radial waves due to the current di stribution on the via is also discussed in detail.