Sg. Hsu et Rb. Wu, FULL-WAVE CHARACTERIZATION OF A THROUGH HOLE VIA IN MULTILAYERED PACKAGING, IEEE transactions on microwave theory and techniques, 43(5), 1995, pp. 1073-1081
A full-wave analysis is presented for the propagation characteristics
of a through hole via connecting two semi-infinitely long transmission
lines in multi-layered packaging environment, The current distributio
n on the via and a section of transmission line is solved under the th
in wire approximation by the moment method and the scattering paramete
rs are extracted by the matrix pencil method, The Green's function in
multilayer packaging environment is derived by applying the image theo
ry and evaluated by the help of the Poisson summation formula, Numeric
al results are included to investigate the frequency-dependent propaga
tion characteristics for via structures with various geometrical param
eters, e,g., the via height, wire diameter, and distance between two g
round planes, The excitation of the radial waves due to the current di
stribution on the via is also discussed in detail.