The adsorption of a cationic polyacrylamide (acrylamide/beta methacryl
oxyethyltrimethylammonium methyl sulfate copolymer) onto an imidazole
catalysed bisphenol-A based epoxy resin surface was examined by surfac
e wetting, The work of adhesion of diodemethane, ethylene glycol and w
ater was measured on microscopically smooth epoxy surfaces using a Wil
hemy plate method, in both advancing and receding modes, The cationic
polyacrylamide was adsorbed from aqueous solutions as a function of th
e pH of the solution, In addition to the cationic quaternary amine gro
ups along the polymer chain, there were carboxylate groups from amide
hydrolysis, which had a pK(a) of 10.73. The surface wetting of neither
diodomethane nor ethylene glycol was sensitive to the adsorbed polyac
rylamide, Wetting of the surface by water was very sensitive to the pr
esence of adsorbed polyacrylamide. Polyacrylamides in solutions below
pH 9 adsorbed onto the epoxy surface resulting in increased water adhe
sion to the surface, When the polyacrylamide solution was greater than
pH 9 carboxylate groups ionized and the anions inhibited adsorption o
f the polyacrylamide. The water wetting measurements were shown to cor
relate with the adsorption of Pd/Sn colloidal particles used for elect
roless deposition of copper circuit lines on printed circuit boards. (
C) 1997 Academic Press