DIAGNOSTICS FOR PLASMA PROCESSING (ETCHING PLASMAS) (INVITED)

Citation
N. Hershkowitz et Ra. Breun, DIAGNOSTICS FOR PLASMA PROCESSING (ETCHING PLASMAS) (INVITED), Review of scientific instruments, 68(1), 1997, pp. 880-885
Citations number
31
Categorie Soggetti
Physics, Applied","Instument & Instrumentation
ISSN journal
00346748
Volume
68
Issue
1
Year of publication
1997
Part
2
Pages
880 - 885
Database
ISI
SICI code
0034-6748(1997)68:1<880:DFPP(P>2.0.ZU;2-Q
Abstract
Plasma processing diagnostics play two different roles-characterizatio n and control. The goal of plasma characterization is to establish con nections of data with external parameters and to verify models. The go al of control diagnostics is to make noninvasive in situ measurements of relevant processing parameters. Diagnostics used in semiconductor e tching are considered. These include Langmuir probes, laser induced fl uorescence, optical emission spectroscopy, infrared and Fourier transf orm infrared absorption spectroscopy, mass spectrometry, microwave int erferometry, and radio frequency diagnostics. An example is given of t he use of many diagnostics in characterizing SiO2 and Si etching by fl uorocarbons. (C) 1997 American Institute of Physics.