S. Scharf et al., TEMPERATURE-DEPENDENT POSITIVE OXIDE CHARGE ANNEALING BY ELECTRON-TUNNELING, Semiconductor science and technology, 10(5), 1995, pp. 586-591
The charge transfer processes between hole traps in SiO2 and the adjac
ent Si have been investigated. The annealing of positive oxide charge
in the Si/SiO2/Al structures can be described by a modified tunnelling
model. The main topics are the correct description of the wavevector
in the whole oxide bandgap using a two-band approximation and the cons
ideration of the temperature-dependent occupation of tunnel states at
the silicon interface. Holes are generated and trapped in the oxide ne
ar the Si/SiO2 interface during vacuum ultraviolet irradiation (10.2 e
V) at positive gate voltage. Subsequent annealing is observed in the t
emperature range from 80 K to 420 K. Measurements and calculations are
in good agreement for a hole trap energy E(t0) = 6.5 +/- 0.2 eV above
the oxide valance band edge. In our model the temperature influence c
an be explained by the Fermi occupation function of the silicon states
which are the initial states for tunnelling transitions. The bias dep
endence of oxide charge annealing is also consistent with this model a
nd reflects the dependence of the tunnelling rate on the applied field
due to the shift of hole trap states relative to the silicon Fermi le
vel.