THERMAL AND GRINDING INDUCED RESIDUAL-STRESSES IN A SILICON-CARBIDE PARTICLE-REINFORCED ALUMINUM METAL-MATRIX COMPOSITE

The residual stresses in a silicon carbide particle-reinforced alumini um (SiCp/Al) metal matrix composite (MMC) were measured using the X-ra y diffraction method. The thermal residual stresses induced by anneali ng were found to be hydrostatic tension for the Al matrix and hydrosta tic compression for the SiC reinforcement. After grinding treatment, t he force equilibrium between these hydrostatic stresses was disturbed and compressive stresses were measured in both constituents. The effec t of grinding extended into the bulk, and depth profiles of the residu al stresses in both constituents were obtained by layer removal. The b ehaviour exhibited in these depth profiles is explained and their usef ulness is indicated.