SHAPE-MEMORY EFFECT IN-DIFFUSION BONDED CU BASE SHAPE-MEMORY ALLOYS STEEL INTERFACES

In many applications, Cu base Shape Memory Alloys (SMA's) are a more e conomical alternative to other systems showing Shape Memory Effect (SM E). However, bearing in mind the potential use of these SMA it is beco ming increasingly important to develop suitable techniques to join the m satisfactorily to themselves and to another material. In that sense, a liquid phase diffusion bonding process with silver/copper interlaye rs is proposed for bonding Cu base SMA's to the ASTM-1045 steel with s emi-hard denomination. Specimens have been metallographically characte rized by SEM. The bend strength of the bonded part is attained over 80 % of that of the base materials. For checking the SME, the ratio of th e total heat measured in forward to reverse thermoelastic martensitic transformation, measured by Differential Scanning Calorimetry DSC), ha s been used.