F. Marketz et al., A COMPUTATIONAL MICROMECHANICS STUDY ON VARIANT-COALESCENCE IN A CU-AL-NI SHAPE-MEMORY ALLOY, Journal de physique. IV, 5(C2), 1995, pp. 537-542
In shape memory alloys (SMA) reorientation of crystallographic variant
s upon loading takes place in a temperature regime lower than the mart
ensite finish temperature M(f) a process which is denoted as variant c
oalescence (VC). The macroscopic deformation behavior due to VC of a p
olycrystalline Cu-Al-Ni shape memory alloy is studied by introducing a
combined computational micromechanics and continuum-thermodynamics fr
amework. For the simulation it is assumed that the VC starts from a se
lf-accommodating morphology of thermo-induced martensite. It proceeds
until each of the diamond-shaped plate groups contains the most favora
ble of its four variants. The kinematics of the parent --> martensite
transformation are described by stress-free transformation tensors for
crystallographic variants of thermo-induced martensite emerging along
habit planes. We persue a thermodynamic field concept for VC by intro
ducing a Gibbs free energy formulation to describe the thermodynamic s
tate of the stressed polycrystalline mesodomain. We prescribe the kine
tics of the reorientation process on the size scale of the crystallite
s in terms of the mobility of the boundaries between martensitic Varia
nts (intervariant boundaries). Then the assumed reorientation process
is the subject of a micromechanical simulation. The transformation-ind
uced microstress and microstrain fields are computed. By checking the
thermodynamic admissibility of any small increment of the reorientatio
n process the corresponding required increment of externally-applied t
ensile stress can be calculated and the overall stress-strain curve fo
r the assumed reorientation process results. VC is studied in the two
limit cases of high and low mobility of the intervariant boundaries be
tween martensitic variants forming self-accommodating plate groups. Th
e effect of the mobility of intervariant boundaries on the stress-stra
in curve is quantified by a polycrystalline finite-element analysis.