M. Saran et A. Naem, APPLICATION OF ULTRAVIOLET DIFFUSE-REFLECTANCE IN THE STUDY OF SILICIDE FILMS, Journal of the Electrochemical Society, 142(5), 1995, pp. 1688-1692
The use of surface reflectivity techniques as a means of monitoring si
licide films grown using rapid thermal annealing has been examined in
the present study. Reflectivity changes were correlated with the conve
ntional sheet resistance measurement on silicide films. The g-line ref
lectivity of Ti and Co silicides is observed to be sensitive to the gr
owth conditions as well as to substrate doping conditions. The measure
d reflectivity changes seem to indicate modifications in silicide surf
ace morphology. Further, a correlation is found between surface modifi
cations and crystal structure changes during film growth under first s
ilicidation anneal. A subsequent higher temperature second anneal does
not modify the surface of the silicide films. This observation indica
tes that the technique could be useful for examining, post facto the t
hermal history of the fully processed films. At high first anneal temp
eratures (>900 degrees C) the dynamics of film surface evolution chang
e significantly, as indicated by significant changes in reflectivity b
ehavior. The diffuse reflectance technique is more sensitive in monito
ring silicide process than the conventional sheet resistance technique
, and can be used as a rapid in-line process monitoring and analysis t
ool for examining the silicide process.