IN-SITU CHARACTERIZATION OF ANODIC SILICON-OXIDE FILMS BY AC-IMPEDANCE MEASUREMENTS

Citation
P. Schmuki et al., IN-SITU CHARACTERIZATION OF ANODIC SILICON-OXIDE FILMS BY AC-IMPEDANCE MEASUREMENTS, Journal of the Electrochemical Society, 142(5), 1995, pp. 1705-1712
Citations number
36
Categorie Soggetti
Electrochemistry
ISSN journal
00134651
Volume
142
Issue
5
Year of publication
1995
Pages
1705 - 1712
Database
ISI
SICI code
0013-4651(1995)142:5<1705:ICOASF>2.0.ZU;2-0
Abstract
Anodic oxide films grown on Si in an aqueous NH4OH solution have been characterized by in situ. ac impedance techniques and their behavior c ompared to thermal SiO2 oxides. Mott-Schottky analysis of oxide-free p - and n-type Si leads to doping concentrations which are in excellent agreement with independent data of conductivity measurements. The grow th of anodic oxides can be monitored with in situ impedance measuremen ts. Anodic oxide films exhibit a nonideal capacitive behavior and henc e a constant-phase element has to be introduced for the evaluation of the experimental results in terms of an equivalent circuit. For oxides thicker than approximate to 50 Angstrom the roughness factor for the oxide surface can be determined by a comparison of the capacitance res ults with the film thickness obtained from x-ray photoelectron spectro scopy (XPS) measurements. For thinner oxides the space-charge capacita nce in the Si and the effect of the surface roughness have to be consi dered to obtain a good agreement of impedance and XPS data. A comparis on of impedance spectra of anodic and thermal oxides shows that anodic oxides not only exhibit less ideal capacitive behavior but also show a drastically lower charge-transfer resistance indicating a relatively high mobility of ions in the anodic oxide film. The nonideality of th e anodic oxides is also evident from cyclic capacitance-voltage (C-V) measurements in which a strong hysteresis is observed in contrast to t hermal oxides for the anodic oxide films. Furthermore, the dielectric constant of the anodic oxides is higher than for ideal SiO2 films, whi ch can most probably be attributed to the presence of hydroxides in th e film. The quality of the anodic oxide films can be significantly imp roved by annealing. The imperfect nature of the as-grown anodic oxide films is also reflected in a lower chemical resistance to etching in N H4OH solutions compared to thermal oxides. By postoxidation annealing also the chemical resistance of anodic oxides is greatly improved.