The behavior of bimetallic systems of the platinum group and copper gr
oup metals in the periodic fable of the elements is interesting in reg
ard to applications in microelectronics and in heterogeneous catalysis
by metallic surfaces. Diffusion phenomena occurring at the interface
of the two layers may influence physical and chemical properties of th
e system. In the reported study interdiffusion in silver/palladium cou
ples has been investigated in the temperature interval 423-523 K by Au
ger depth profiling. The samples under investigation consisted of pall
adium substrates of 99.99% purity, 0.5 mm thickness and 5 x 5 mm(2) ar
ea and thin silver films of 260 mm thickness deposited onto the Pd sub
strates and annealed in UHV conditions. The model based on Whipple's F
ourier-LaPlace transform solution to the problem of coupled grain boun
dary and intragranular diffusion was applied in order to determine int
erdiffusion coefficients and activation energy of interdiffusion. The
results of interdiffusion parameters have been analyzed and discussed.