LOW-COST MOLDED PACKAGING FOR OPTICAL-DATA LINKS

In order to lower the cost of optical data link packaging, a new techn ology has been developed which integrates optical and electrical compo nents in a single, sealed, transfer molded package. This technology ut ilizes leadframes for low cost and mass handling. Overmolding is used for package sealing and optical port alignment, A unique process, two- step transfer molding, allows for internal shielding, intermediate IC testing, ease of assembly, and IC package sealing, An injection-molded outer housing is used for connector insertion and external shielding (through the use of conductive plastics), The first application of thi s technology is a high performance optical transceiver package for the growing FDDI market (125 MB/s), With a duplex MIC connector, this pac kage conforms to an industry standard outline and pinout. The optical transceiver easily meets full FDDI specifications. The design integrat es an LED, PIN, transmitter IC, receiver IC, and two capacitors in a s ingle, overmolded package, The final assembly sequence was conceived u sing the latest Design For Simplicity (DFS) principles, This paper des cribes the design concept and prototype model performance results.