MCM-L PRODUCT DEVELOPMENT PROCESS FOR LOW-COST MCMS

System size and cost reduction are often the largest factors for inter est in commercial MCM's. Performance improvement is generally of secon dary interest. Development and qualification can add significantly to the total cost of an MCM, so in addition to the normal desire to provi de reliable products, the cost of doing so has gained increased import ance. A new product introduction (NPI) process for low-cost MCM's has been implemented to rapidly provide cost-effective, reliable MCM solut ions for cost-sensitive MCM users. The NPI process is based on three a ttributes: leverage single chip package (SCP) experience and technolog y, perform product family qualifications, and use only previously qual ified silicon in MCM's. Application of the NPI process to the developm ent and qualification of a 28 mm PQFP (Plastic Quad Flat Pack)-based M CM package is presented in this paper.