Jl. Evans et al., MCM-L TECHNOLOGY - A SYSTEMS COST-ANALYSIS FOR A HIGH-VOLUME AUTOMOTIVE ELECTRONICS APPLICATION, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 28-32
Cost concerns related to the development and manufacturability of mult
ichip modules have limited the widespread use of MCM's for high-volume
, low-cost applications. This paper discusses the many elements necess
ary to evaluate fully the financial effects of MCM programs. In partic
ular, this paper evaluates a development program for a multichip modul
e design targeted for a high volume automotive electronics control mod
ule. Often the added material costs associated with multichip modules
prohibit MCM usage for low cost applications. This paper deals with th
e overall costs and savings associated with MCM development. While eac
h decision to incorporate MCM's within a product design must be made i
ndividually, the analysis detailed below provides considerable insight
into the overall systems cost involved with MCM's.