Ms. Basel et al., SIMULATION OF HIGH-SPEED INTERCONNECTS USING A CONVOLUTION-BASED HIERARCHICAL PACKAGING SIMULATOR, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 74-82
A specialized packaging simulator is presented which uses an impulse r
esponse model of the interconnect network to model high speed digital
systems. Behavioral models of drivers and receivers are used. A hierar
chical strategy is developed which uses point modeling of discontinuit
ies and the concept of coupling groups to facilitate tradeoffs between
accuracy and run time. A new impulse response/convolution technique i
s developed to efficiently handle large distributed interconnect netwo
rks. With this technique, impulse response thresholding provides a smo
oth transistion from delay modeling of interconnects to full distribut
ed circuit simulation.