SIMULATION OF HIGH-SPEED INTERCONNECTS USING A CONVOLUTION-BASED HIERARCHICAL PACKAGING SIMULATOR

Citation
Ms. Basel et al., SIMULATION OF HIGH-SPEED INTERCONNECTS USING A CONVOLUTION-BASED HIERARCHICAL PACKAGING SIMULATOR, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 74-82
Citations number
46
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
ISSN journal
10709894
Volume
18
Issue
1
Year of publication
1995
Pages
74 - 82
Database
ISI
SICI code
1070-9894(1995)18:1<74:SOHIUA>2.0.ZU;2-R
Abstract
A specialized packaging simulator is presented which uses an impulse r esponse model of the interconnect network to model high speed digital systems. Behavioral models of drivers and receivers are used. A hierar chical strategy is developed which uses point modeling of discontinuit ies and the concept of coupling groups to facilitate tradeoffs between accuracy and run time. A new impulse response/convolution technique i s developed to efficiently handle large distributed interconnect netwo rks. With this technique, impulse response thresholding provides a smo oth transistion from delay modeling of interconnects to full distribut ed circuit simulation.