ELECTRICAL DESIGN OF AN MCM PACKAGE FOR A MULTIPROCESSOR DIGITAL SYSTEM

Authors
SARFARAZ A SWAMINATHAN M CROCKER J BHATIA H NEALON M
Citation
A. Sarfaraz et al., ELECTRICAL DESIGN OF AN MCM PACKAGE FOR A MULTIPROCESSOR DIGITAL SYSTEM, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(1), 1995, pp. 127-143
Citations number
7
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging → ACNP
ISSN journal
10709894
Volume
18
Issue
1
Year of publication
1995
Pages
127 - 143
Database
ISI
SICI code
1070-9894(1995)18:1<127:EDOAMP>2.0.ZU;2-5
Abstract
The electrical design of a Ceramic Multichip Module (MCM-C) CPU node f or a multiprocessor parallel system have been presented, The electrica l performance of the package has been evaluated through modeling and s imulation using models that provide both qualitative as well as quanti tative measures on signal integrity, coupled noise and switching noise that are required to guarantee proper system operation, Details on th e techniques used to optimize the MCM package have also been explained in this paper,