The effect of enhanced diffusion caused by the electrical deactivation
of arsenic on the reverse short-channel effect (RSCE) in NMOS devices
is investigated, A simple four-mask process was utilized to fabricate
deep sub-micron NMOS devices, Source/drain (S/D) implant and anneal c
onditions were varied in order to determine their implications on the
RSCE, Results indicate that when high concentrations of arsenic deacti
vate, enhanced diffusion occurs, leading to significantly more RSCE, T
his implies that the dose of the arsenic implant and the subsequent an
neals should be carefully considered in source/drain engineering.