The threshold voltage sensitivity of fully depleted SOI MOSFET's to va
riations in SOI silicon film thickness was examined through both simul
ation and device experiments. The concept of designing the channel V(t
h) implant to achieve a constant dose within the film, rather than a c
onstant doping concentration, was studied for a given range of film th
icknesses. Minimizing the variation in retained dose reduced the thres
hold voltage sensitivity to film thickness for the range of t(si) exam
ined. One-dimensional process simulations were performed to determine
the optimal channel implant condition that would reduce the variation
in retained dose using realistic process parameters for both NMOS and
PMOS device processes. SOI NMOS transistors were fabricated. The exper
imental results confirmed the simulation findings and achieved a reduc
ed threshold voltage sensitivity.