EXCIMER LASER-INDUCED DEPOSITION OF COPPER FROM CU(HFAC)(TMVS)

Authors
IZQUIERDO R BERTOMEU J SUYS M SACHER E MEUNIER M
Citation
R. Izquierdo et al., EXCIMER LASER-INDUCED DEPOSITION OF COPPER FROM CU(HFAC)(TMVS), Applied surface science, 86(1-4), 1995, pp. 509-513
Citations number
11
Categorie Soggetti
Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
Journal title
Applied surface science → ACNP
ISSN journal
01694332
Volume
86
Issue
1-4
Year of publication
1995
Pages
509 - 513
Database
ISI
SICI code
0169-4332(1995)86:1-4<509:ELDOCF>2.0.ZU;2-J
Abstract
Copper films have been deposited on TiN and fluoropolymer substrates f rom the KrF excimer-laser-assisted decomposition of Cu(hfac)(TMVS). Us ing H-2 as the carrier gas, very uniform, shiny metal-like films were deposited with grain size of 50 to 100 nm. XPS measurements show that the precursor is reduced to metallic copper, and that a Cu/C atomic ra tio of up to 17 is obtained.