HILLOCK FORMATION DURING ELECTROMIGRATION IN CU AND AL THIN-FILMS - 3-DIMENSIONAL GRAIN-GROWTH

Citation
A. Gladkikh et al., HILLOCK FORMATION DURING ELECTROMIGRATION IN CU AND AL THIN-FILMS - 3-DIMENSIONAL GRAIN-GROWTH, Applied physics letters, 66(10), 1995, pp. 1214-1215
Citations number
8
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
66
Issue
10
Year of publication
1995
Pages
1214 - 1215
Database
ISI
SICI code
0003-6951(1995)66:10<1214:HFDEIC>2.0.ZU;2-A