ANALYSIS OF BENDING CREEP-BEHAVIOR OF SILICON-NITRIDE CERAMICS AT ELEVATED-TEMPERATURE

Authors
HATANAKA K YANG H
Citation
K. Hatanaka et H. Yang, ANALYSIS OF BENDING CREEP-BEHAVIOR OF SILICON-NITRIDE CERAMICS AT ELEVATED-TEMPERATURE, JSME international journal. Series A, mechanics and material engineering, 38(2), 1995, pp. 194-200
Citations number
7
Categorie Soggetti
Engineering, Mechanical","Material Science
Journal title
JSME international journal. Series A, mechanics and material engineering → ACNP
ISSN journal
13408046
Volume
38
Issue
2
Year of publication
1995
Pages
194 - 200
Database
ISI
SICI code
1340-8046(1995)38:2<194:AOBCOS>2.0.ZU;2-2
Abstract
Three-point bending creep behavior of hot-pressed silicon nitride cera mics was investigated at 1 170 degrees C. A unique creep constitutive equation consisting of linear and power law terms was proposed, and th e numerical calculation programs for determining the parameters includ ed in the constitutive equation and for describing the creep deformati on behavior of silicon nitride ceramics at elevated temperatures were developed. The model for interpreting the time-dependent deflection ra te and the change in curvature of the beam due to creep under three-po int bend loading was also developed, which fitted well the experimenta l data.