I. George et al., THIN MEMBRANES WITH OPTIMIZED THERMOMECHANICAL PROPERTIES FOR MICROSYSTEM APPLICATIONS, Sensors and actuators. A, Physical, 46(1-3), 1995, pp. 38-42
Thin polymer [poly(phenylquinoxaline)] membranes with good adhesion pr
operties to standard metals have been produced. Chemical and mechanica
l integrity tests have been performed, thus showing possible applicati
ons of this material as a thermally insulating support in microthermom
eters and heat microsources. Thin silicon nitride membranes with a tun
ed stress level have also been produced. A common mechanical 'blister'
test has been applied to both types of membranes. Standard IC process
equipment has been used in this work.