THIN MEMBRANES WITH OPTIMIZED THERMOMECHANICAL PROPERTIES FOR MICROSYSTEM APPLICATIONS

Citation
I. George et al., THIN MEMBRANES WITH OPTIMIZED THERMOMECHANICAL PROPERTIES FOR MICROSYSTEM APPLICATIONS, Sensors and actuators. A, Physical, 46(1-3), 1995, pp. 38-42
Citations number
11
Categorie Soggetti
Engineering, Eletrical & Electronic","Instument & Instrumentation
ISSN journal
09244247
Volume
46
Issue
1-3
Year of publication
1995
Pages
38 - 42
Database
ISI
SICI code
0924-4247(1995)46:1-3<38:TMWOTP>2.0.ZU;2-J
Abstract
Thin polymer [poly(phenylquinoxaline)] membranes with good adhesion pr operties to standard metals have been produced. Chemical and mechanica l integrity tests have been performed, thus showing possible applicati ons of this material as a thermally insulating support in microthermom eters and heat microsources. Thin silicon nitride membranes with a tun ed stress level have also been produced. A common mechanical 'blister' test has been applied to both types of membranes. Standard IC process equipment has been used in this work.