ELECTRONIC SYSTEMS IN DENSE 3-DIMENSIONAL PACKAGES

A new packaging technology has been developed which permits the produc tion of systems in a single miniature three-dimensional multichip modu le (MCM) and a prototype 'smart camera' has been developed as a techno logical demonstrator. The demonstrator is a complex microsystem incorp orating standard commodity parts such as a camera chip, integrated cir cuits and discrete components. This smart camera has been produced in a lightweight, low-volume package. The packaging technique is scalable to a low-cost manufacturing process and offers improved electrical pe rformance over conventional methods.