LOW-TEMPERATURE PYREX GLASS WAFER DIRECT BONDING

Authors
PIGEON F BIASSE B ZUSSY M
Citation
F. Pigeon et al., LOW-TEMPERATURE PYREX GLASS WAFER DIRECT BONDING, Electronics Letters, 31(10), 1995, pp. 792-793
Citations number
10
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronics Letters → ACNP
ISSN journal
00135194
Volume
31
Issue
10
Year of publication
1995
Pages
792 - 793
Database
ISI
SICI code
0013-5194(1995)31:10<792:LPGWDB>2.0.ZU;2-K
Abstract
The authors focus on the low-temperature direct bonding of Pyrex glass wafers. A hydrophilic treatment has been used to decrease the process temperature. after a final heat treatment at 350 degrees C, a tensile strength of similar to 250kgf/cm(2) has been measured.