THERMOMAGNETIC ANALYSIS OF SEMICONDUCTOR-DEVICES USING TRENDY

Authors
DIMA G KRABBENBORG B MOUTHAAN T PROFIRESCU MD WALLINGA H
Citation
G. Dima et al., THERMOMAGNETIC ANALYSIS OF SEMICONDUCTOR-DEVICES USING TRENDY, Compel, 13(4), 1994, pp. 727-733
Citations number
7
Categorie Soggetti
Mathematical Method, Physical Science","Computer Science Interdisciplinary Applications",Mathematics,"Engineering, Eletrical & Electronic
Journal title
Compel → ACNP
ISSN journal
03321649
Volume
13
Issue
4
Year of publication
1994
Pages
727 - 733
Database
ISI
SICI code
0332-1649(1994)13:4<727:TAOSUT>2.0.ZU;2-O
Abstract
This paper describes the two-dimensional numerical solution of the sys tem of partial differential equations governing the carrier and heat t ransport in a semiconductor structure in the presence of a magnetic fi eld. The model is based on a thermodynamic approach [1-3] and it was i mplemented in the thermomagnetic module of 2D process/device simulator TRENDY [4,5]. The influence of temperature gradients on the response of a magnetic field sensor is presented in the paper.