ADHESION PROMOTION FOR EPOXY RESIN COPPER AND POLYIMIDE/COPPER JOINTSBY A 2-COMPONENT COUPLING SYSTEM OF POLY(4-VINYLIMIDAZOLE) AND CYSTAMINE/

Authors
DAI Q LU Y
Citation
Q. Dai et Y. Lu, ADHESION PROMOTION FOR EPOXY RESIN COPPER AND POLYIMIDE/COPPER JOINTSBY A 2-COMPONENT COUPLING SYSTEM OF POLY(4-VINYLIMIDAZOLE) AND CYSTAMINE/, Die Angewandte makromolekulare Chemie, 227, 1995, pp. 121-129
Citations number
23
Categorie Soggetti
Polymer Sciences
Journal title
Die Angewandte makromolekulare Chemie → ACNP
ISSN journal
00033146
Volume
227
Year of publication
1995
Pages
121 - 129
Database
ISI
SICI code
0003-3146(1995)227:<121:APFERC>2.0.ZU;2-S
Abstract
A two-component coupling agent layer on copper, produced by immersion of copper in poly(4-vinylimidazole) solution and then in cystamine sol ution, showed better anticorrosive performance and higher adhesive str ength for epoxy resin and polyimide than each single component even at high temperature.