Ic. Noyan et al., RESIDUAL-STRESS STRAIN ANALYSIS IN THIN-FILMS BY X-RAY-DIFFRACTION, Critical reviews in solid state and materials sciences, 20(2), 1995, pp. 125-177
Residual stresses are found in the majority of multilayer thin film st
ructures used in modern technology. The measurement and modeling of su
ch stress fields and the elucidation of their effects on structural re
liability and device operation have been a ''growth area'' in the lite
rature, with contributions from authors in various scientific and engi
neering disciplines. In this article the measurement of the residual s
tresses in thin film structures with X-ray diffraction techniques is r
eviewed and the interpretation of such data and their relationship to
mechanical reliability concerns are discussed.