RESIDUAL-STRESS STRAIN ANALYSIS IN THIN-FILMS BY X-RAY-DIFFRACTION

Citation
Ic. Noyan et al., RESIDUAL-STRESS STRAIN ANALYSIS IN THIN-FILMS BY X-RAY-DIFFRACTION, Critical reviews in solid state and materials sciences, 20(2), 1995, pp. 125-177
Citations number
112
Categorie Soggetti
Physics, Condensed Matter
ISSN journal
10408436
Volume
20
Issue
2
Year of publication
1995
Pages
125 - 177
Database
ISI
SICI code
1040-8436(1995)20:2<125:RSAITB>2.0.ZU;2-4
Abstract
Residual stresses are found in the majority of multilayer thin film st ructures used in modern technology. The measurement and modeling of su ch stress fields and the elucidation of their effects on structural re liability and device operation have been a ''growth area'' in the lite rature, with contributions from authors in various scientific and engi neering disciplines. In this article the measurement of the residual s tresses in thin film structures with X-ray diffraction techniques is r eviewed and the interpretation of such data and their relationship to mechanical reliability concerns are discussed.