Nk. Chen et C. Lee, OXYNITRIDATION-ENHANCED DIFFUSION OF PHOSPHORUS IN [100] SILICON, Journal of the Electrochemical Society, 142(6), 1995, pp. 2051-2054
Diffusion of phosphorus in silicon in an ambient of pure N-2, pure NH3
, and mixtures of NH3 and N-2 has been investigated to study the effec
t of the oxynitridation reaction on the diffusivity. With a thin SiO2
layer on the silicon wafer and a low phosphorus concentration, the dif
fusion coefficient of phosphorus can be expressed as a function of the
partial pressure of NH3 and temperature as D = 0.145 exp (-3.26 eV/kT
) + 1.718 x 10(-6) exp (-1.72 eV/kT)p(NH3) cm(2) s(-1) At the same tim
e, the ratio of the interstitial concentration under oxynitridation co
nditions to the concentration under inert conditions can be expressed
as C-I/C-I = 1 + 1.183 x 10(-5) exp (1.54 eV/kT)p(NH3) By using P dif
fusion as an interstitial monitor, the data (Ref. 1) of oxynitridatian
-enhanced B diffusion are analyzed and the fraction of boron diffusion
which occurs through the interstitial mechanism is calculated to be 0
.88.