The oxidation of semiconductors by RF (radio-frequency) plasma anodiza
tion offers several advantages over conventional thermal furnace oxida
tion, such as low process temperature and faster oxidation rate. This
paper investigates the electrical properties of the plasma-grown oxide
on SiGe at room temperature and compares them with thermally grown ox
ides of SiGe. An interface state peak has been observed at around E(v)
+ 0.75 eV. This peak is found to be caused by the presence of the SiG
e layer and we present evidence that it is related to a silicon dangli
ng bond. We have also observed that the magnitude of the voltage pulse
necessary to induce avalanche electron injection increases through th
e presence of the SiGe layer. We believe that this is related to the i
ncreased ionization rate associated with the smaller bandgap of SiGe.
The presence of Ge atoms in the plasma oxide has introduced electron t
raps with capture cross sections of the order of 10(-15) and 10(-16) c
m(2). Negative bias temperature stress indicates that the bonding betw
een Ge and H is weak. This aging test also supports the theory that th
e interface states are acceptor-like in the upper half and donor-like
in the lower half of the energy bandgap.