EFFECT OF SURFACE-ACTIVE AGENTS ON THE INITIAL FORMATION OF ELECTRODEPOSITED COPPER LAYERS

The kinetics of formation and the structure of copper layers are inves tigated in the presence of a complex additive for bright acid copper p lating. It is shown that, in the presence of additive, two maxima are observed on the voltammetric curve. The first may be explained in term s of the formation of a complex between the components of the additive and the cuprous ion. The structure of the initial copper deposits is studied using the double pulse technique. It is shown that the size of separate crystallites strongly decreases in the presence of the addit ive which also blocks vertical growth and favours lateral growth.