EFFECT OF SURFACE-ACTIVE AGENTS ON THE INITIAL FORMATION OF ELECTRODEPOSITED COPPER LAYERS

Authors
Citation
R. Rashkov et C. Nanev, EFFECT OF SURFACE-ACTIVE AGENTS ON THE INITIAL FORMATION OF ELECTRODEPOSITED COPPER LAYERS, Journal of Applied Electrochemistry, 25(6), 1995, pp. 603-608
Citations number
25
Categorie Soggetti
Electrochemistry
ISSN journal
0021891X
Volume
25
Issue
6
Year of publication
1995
Pages
603 - 608
Database
ISI
SICI code
0021-891X(1995)25:6<603:EOSAOT>2.0.ZU;2-S
Abstract
The kinetics of formation and the structure of copper layers are inves tigated in the presence of a complex additive for bright acid copper p lating. It is shown that, in the presence of additive, two maxima are observed on the voltammetric curve. The first may be explained in term s of the formation of a complex between the components of the additive and the cuprous ion. The structure of the initial copper deposits is studied using the double pulse technique. It is shown that the size of separate crystallites strongly decreases in the presence of the addit ive which also blocks vertical growth and favours lateral growth.